
A no-lead IC package, quad (QFN), dual (DFN, SON), land grid (LGA) or chip-scale (BGA, WLP): a black body with a round pin-1 mark and nothing metal showing, in the package you choose. Boards place it at each such footprint.
- Made by
ReDo.Pro- Kind
- Parametric part
- Licence
- CC-BY-SA-4.0
- Keywords
- bga, chip, dfn, electronics, ic, lfcsp, lga, package, powerdi, qfn, smd, son, tdfn, tdson, tqfn, uqfn, uson, vdfn, wlp, wqfn, wson, plcc, lcc
| Overall size (X × Y × Z) | 5 × 5 × 0.9 mm |
|---|---|
| Volume | 21 mm³ |
| Package | QFN / DFN |